THSIA Signs Landmark Semiconductor MOU with ASEAN partners Forging Historic Semiconductor Cooperation in ASEAN

THSIA Signs Landmark Semiconductor MOU with ASEAN partners Forging Historic Semiconductor Cooperation in ASEAN
 
Petaling Jaya, Malaysia – July 24, 2025 – Dr. Naiyavudhi Wongkomet, Vice President of the Thai Semiconductor Industry Trade Association (THSIA) and a member of the Board of the Director of Silicon Craft Technology PLC, signed a Memorandum of Understanding (MOU) on semiconductor collaboration alongside four other leading industry associations from across the ASEAN region. The signing took place during the ASEAN Semiconductor Industry Summit (ASEMIS) 2025 and marks a significant milestone in uniting the semiconductor industry across Southeast Asia. The signing ceremony was witnessed by the Prime Minister of Malaysia, Anwar Ibrahim, underscoring the importance of this historic regional cooperation.
 
The MOU was established among the Malaysia Semiconductor Industry Association (MSIA), an industry association that is the voice of the semiconductor and electronics industry in Malaysia, the Singapore Semiconductor Industry Association (SSIA); the Semiconductor and Electronics Industries in the Philippines Foundation, Inc. (SEIPI); the Thai Semiconductor Industry Trade Association (THSIA); and the Vietnam Electronic Industries Association (VEIA). The agreement aims to strengthen regional collaboration within the semiconductor industry by promoting a sustainable semiconductor supply chain, fostering knowledge sharing, and exchanging best practices. This collective effort is expected to enhance ASEAN’s global competitiveness in the semiconductor sector.
 
This historic signing of the Memorandum of Understanding is a powerful symbol of ASEAN’s collective commitment to elevate its role and become an integral part of the global semiconductor value chain.